Empty templates and libraries

2025-10-06 11:54:42 +11:00
parent 46a43db357
commit 8a1bd1c385
7 changed files with 846 additions and 3 deletions
--- a/Template/Template.kicad_pcb
+++ b/Template/Template.kicad_pcb
@@ -0,0 +1,144 @@
+(kicad_pcb
+	(version 20241229)
+	(generator "pcbnew")
+	(generator_version "9.0")
+	(general
+		(thickness 1.6)
+		(legacy_teardrops no)
+	)
+	(paper "A4")
+	(title_block
+		(company "N. Cummings")
+	)
+	(layers
+		(0 "F.Cu" signal)
+		(4 "In1.Cu" signal "In1.Cu - Vert")
+		(6 "In2.Cu" signal "In2.Cu - Horiz")
+		(2 "B.Cu" signal)
+		(9 "F.Adhes" user "F.Adhesive")
+		(11 "B.Adhes" user "B.Adhesive")
+		(13 "F.Paste" user)
+		(15 "B.Paste" user)
+		(5 "F.SilkS" user "F.Silkscreen")
+		(7 "B.SilkS" user "B.Silkscreen")
+		(1 "F.Mask" user)
+		(3 "B.Mask" user)
+		(17 "Dwgs.User" user "User.Drawings")
+		(19 "Cmts.User" user "User.Comments")
+		(21 "Eco1.User" user "User.Eco1")
+		(23 "Eco2.User" user "User.Eco2")
+		(25 "Edge.Cuts" user)
+		(27 "Margin" user)
+		(31 "F.CrtYd" user "F.Courtyard")
+		(29 "B.CrtYd" user "B.Courtyard")
+		(35 "F.Fab" user)
+		(33 "B.Fab" user)
+	)
+	(setup
+		(stackup
+			(layer "F.SilkS"
+				(type "Top Silk Screen")
+			)
+			(layer "F.Paste"
+				(type "Top Solder Paste")
+			)
+			(layer "F.Mask"
+				(type "Top Solder Mask")
+				(thickness 0.01)
+			)
+			(layer "F.Cu"
+				(type "copper")
+				(thickness 0.035)
+			)
+			(layer "dielectric 1"
+				(type "prepreg")
+				(thickness 0.1)
+				(material "FR4")
+				(epsilon_r 4.5)
+				(loss_tangent 0.02)
+			)
+			(layer "In1.Cu"
+				(type "copper")
+				(thickness 0.035)
+			)
+			(layer "dielectric 2"
+				(type "core")
+				(thickness 1.24)
+				(material "FR4")
+				(epsilon_r 4.5)
+				(loss_tangent 0.02)
+			)
+			(layer "In2.Cu"
+				(type "copper")
+				(thickness 0.035)
+			)
+			(layer "dielectric 3"
+				(type "prepreg")
+				(thickness 0.1)
+				(material "FR4")
+				(epsilon_r 4.5)
+				(loss_tangent 0.02)
+			)
+			(layer "B.Cu"
+				(type "copper")
+				(thickness 0.035)
+			)
+			(layer "B.Mask"
+				(type "Bottom Solder Mask")
+				(thickness 0.01)
+			)
+			(layer "B.Paste"
+				(type "Bottom Solder Paste")
+			)
+			(layer "B.SilkS"
+				(type "Bottom Silk Screen")
+			)
+			(copper_finish "None")
+			(dielectric_constraints no)
+		)
+		(pad_to_mask_clearance 0)
+		(allow_soldermask_bridges_in_footprints no)
+		(tenting front back)
+		(pcbplotparams
+			(layerselection 0x00000000_00000000_55555555_5755f5ff)
+			(plot_on_all_layers_selection 0x00000000_00000000_00000000_00000000)
+			(disableapertmacros no)
+			(usegerberextensions no)
+			(usegerberattributes yes)
+			(usegerberadvancedattributes yes)
+			(creategerberjobfile yes)
+			(dashed_line_dash_ratio 12.000000)
+			(dashed_line_gap_ratio 3.000000)
+			(svgprecision 4)
+			(plotframeref no)
+			(mode 1)
+			(useauxorigin no)
+			(hpglpennumber 1)
+			(hpglpenspeed 20)
+			(hpglpendiameter 15.000000)
+			(pdf_front_fp_property_popups yes)
+			(pdf_back_fp_property_popups yes)
+			(pdf_metadata yes)
+			(pdf_single_document no)
+			(dxfpolygonmode yes)
+			(dxfimperialunits yes)
+			(dxfusepcbnewfont yes)
+			(psnegative no)
+			(psa4output no)
+			(plot_black_and_white yes)
+			(sketchpadsonfab no)
+			(plotpadnumbers no)
+			(hidednponfab no)
+			(sketchdnponfab yes)
+			(crossoutdnponfab yes)
+			(subtractmaskfromsilk no)
+			(outputformat 1)
+			(mirror no)
+			(drillshape 1)
+			(scaleselection 1)
+			(outputdirectory "")
+		)
+	)
+	(net 0 "")
+	(embedded_fonts no)
+)